description this pin diode chip is silicon dioxide or nitride passi- vated. the 5082-0012 has a planar construction. the fabrication processes are optimized for long term reliability and tightly controlled for uniformity in electrical performance. outline maximum ratings junction operating and storage temperature range ............................. -65 c to +150 c soldering temperature .......... +425 c for 1 min. max. 5082-0012 pin diode chip for hybrid mic switches/attenuators data sheet features low series resistance: 1.0 ? typical applications this general purpose pin diode is intended for low power switching applications such as duplexers, antenna switching matrices, digital phase shifters, time multiplex filters, tr switches, pulse and amplitude modulators, limiters, leveling circuits, and attenuators. electrical specifications at t a = 25 c typical parameters nearest typical chip equivalent minimum maximum typical reverse part packaged breakdown junction series typical recovery number part no. voltage capacitance resistance lifetime time 5082- 5082- v br (v) c j (pf) r s ( ? ? ? ? ? ) (ns) t rr (ns) 0012 3001 150 0.12 1.0 400 100 test v r = v br v r = 50 v i f = 100 ma i f = 50 ma i f = 20 ma conditions measure f = 1 mhz f = 100 mhz i r = 250 ma v r = 10 v i r 10 ma 90% recovery d x y x 0.10 (4) 0.38 (15) 0.23 (9.0) au. cathode au. anode d 0.03 (1) x 0.05 (2) y 0.03 (1) top contact bottom contact dimensions in millimeters (1/1000 inch) dimensions
assembly and handling procedures for pin chips 1. storage devices should be stored in a dry nitrogen purged dessicator or equivalent. 2. cleaning if required, surface contamination may be removed with electronic grade solvents. typical solvents, such as freon (t.f. or t.m.c.), acetone, deionized water, and methanol, or their locally approved equivalents, can be used singularly or in combinations. typical cleaning times per solvent are one to three minutes. di water and methanol should be used (in that order) in the final cleans. final drying can be accomplished by placing the cleaned dice on clean filter paper and drying with an infrared lamp for 5-10 minutes. acids such as hydrofluoric (hf), nitric (hno 3 ) and hydrochloric (hcl) should not be used. the effects of cleaning methods/solutions should be verified on small samples prior to submitting the entire lot. following cleaning, dice should be either used in assembly (typically within a few hours) or stored in clean containers in a reducing atmosphere or a vacu- um chamber. 3. die attach a. eutectic ausn preform with stage temperature of 310 c for one minute max. auge preform with stage temperature of 390 c for one minute max. b. epoxy for epoxy die-attach, conductive silver-filled or gold- filled epoxies are recommended. this method can be used for all avago pin chips. 4. wire bonding either ultrasonic or thermocompression bonding tech- niques can be employed. suggested wire is pure gold, 0.7 to 1.5 mil diameter. for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, pte. in the united states and other countries. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. obsoletes 5965-8880e 5989-4778en february 23, 2006
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